Enhancing Functional Properties of Thin, Atmospheric Plasma-Sprayed CuCoatings: A Comparative Study of Furnace and Laser Annealing

Produktinformationen

Aleyna Ayse Gökcen, aleyna.goekcen@faps.fau.de, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Nürnberg; Jonas Schickel, jonas.schickel@faps.fau.de, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Nürnberg; Prof. Dr.-Ing. Jörg Franke, lehrstuhlleitung@faps.fau.de, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Nürnberg; Manuela Ockel, manuela.Ockel@faps.fau.de, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Nürnberg; 

https://doi.org/10.53192/ITSC2026634

Thin (10 - 100 µm) electrically and mechanically functional Cu coatings deposited by Atmospheric Plasma Spray often exhibit reduced performance, compared to bulk Cu, due to oxidation, porosity, and limited interlamellar bonding. Heat-treatment is therefore essential to enhance electrical conductivity and adhesion strength. This work presents a systematic comparison of furnace and laser annealing applied to identically produced plasma sprayed Cu coatings. Furnace annealing is performed under nitrogen and nitrogen-hydrogen atmospheres, while laser annealing is conducted using a green disk laser under nitrogen and an infrared disk laser under ambient conditions. The influence of the different annealing methods on the coating properties are investigated. The results reveal differences between thermal and laser annealing. Furnace annealing enables homogeneous microstructural modification and allows mechanical and electrical properties to be enhanced depending on the annealing atmosphere. Laser annealing induces localized microstructural changes that strongly depend on wavelength and energy input, leading to partial remelting, surface modification, and defect formation at higher energy densities. The study highlights fundamental trade-offs between mechanical integrity, electrical performance, and surface morphology and provides guidance for application-specific annealing of thin plasma sprayed Cu coatings.

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Erscheinungsdatum

März 2026

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