Cold Spray Additive Manufacturing of Copper Architectures for Smart Thermal Management in EV Power Electronics

Produktinformationen

Master's Student Simon Beaulne, sbeau143@uottawa.ca, University of Ottawa; Part Time Professor Patrick Richter, Patrick.Richer@uottawa.ca, University of Ottawa; Part Time Professor & Research Associate Mohammed Yandouzi, yandouzi@uottawa.ca, University of Ottawa; Assistant Professor Aleksandra Nastic, aleksandra.nastic@uottawa.ca, University of Ottawa; Prof. Bertrand Jodoin, Bertrand.Jodoin@uottawa.ca, University of Ottawa; Yeonmin Po, Krutik Mistry, Yomna Elsahli

https://doi.org/10.53192/ITSC2026547

Power converters are critical for regulating electrical energy flow in electric vehicles (EVs). Due to high energy levels involved, they are prone to rapid temperature rises, necessitating optimized smart thermal management. Conventional power modules assemblies rely on thermal interface materials to bridge commercially available heat sinks and direct copper bonded (DCB) substrates. However, this introduces large thermal resistance that can degrade over time, limiting long-term performance and maximum operating temperature. This work investigates a novel approach to thermal management in EV power converters by cold spray (CS) additive manufacturing of copper fins structures onto DCB ceramic substrates. The primary challenge lies in applying the CS process without damaging the DCB substrate. Eliminating the use of bridge materials would offer superior thermal performance and prevention of interface material degradation. Additionally, CS provides greater design flexibility, allowing compact and complex architectures that can be tailored to module layouts, and improving heat dissipation.

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PDF-Download zu https://doi.org/10.53192/ITSC2026547

Erscheinungsdatum

März 2026

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Seiten

6