PDF-Download zu https://doi.org/10.53192/ITSC2026514
Deposition of dense plasma spray ceramic coatings with sufficiently bonded splats towards the advanced applications based on the critical bonding temperature concept
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This product will be released at 15 March 2026
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1) Prof. Chang-Jiu Li, licj@mail.xjtu.edu.cn, Xi'an Jiaotong University; 2) Prof. Xiao-Tao Luo, luoxiaotao@xjtu.edu.cn, State Key Laboratory for Mechanical Behavior of Materials; 3) Ph.D student Peng-Yan Shi, School of Materials Science and Enginnering, 4) Professor Cheng-Xin LI, 5) Professor Guan-Jun Yang
https://doi.org/10.53192/ITSC2026514
Plasma spraying has been well developed for variety of industrial applications. It is well known that thermal spray ceramic coatings present a lamellar structure with limited lamellar interface bonding, which degrades the mechanical and physical performances of the coatings significantly and consequently limits the development of coating materials potential. In this present, the intrinsic critical bonding temperature for spreading ceramic droplet to form a bonding with previous splats will be presented, which is defined as the glass transition temperature of ceramic coating material. Accordingly, a critical deposition temperature for splat to form a bonding at the interface in terms of the critical bonding temperature is introduced. When the deposition temperature exceeds the critical bonding temperature a thermal spray ceramic coating with sufficiently bonded splats chemically is achieved, otherwise a conventional lamellar structured coating is deposited instead. It will be shown that based on the concept of the critical bonding temperature, the ceramic coatings with different microstructures from a fully dense one to porous ones with different pore geometries can be created to fulfill different service requirements for advanced applications such as for wear-resistant coatings, highly durable thermal barrier coatings, energy storage device and high performance SOFC manufacturing.
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- PDF-Download zu https://doi.org/10.53192/ITSC2026514
- Erscheinungsdatum
- March 2026
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